Dr. Mike Kok

• PhD in mechanical engineering, specializing in applied mechanics, and mechanical simulation using finite element analysis.
• Mechanical engineer with 5 years of industrial experience in an MNC in electronics/telecommunication industry, and close to 15 years of working experience in academia. 
• Motorola certified Six Sigma Green Belt.
• Stanford d.school certified Design Thinking trainer 

• Michigan State University, East Lansing, Michigan, USA
  

Doctor of Philosophy Degree in Mechanical Engineering, August 2004

Thesis: Finite Element Simulations of Ceramic Powder Compaction and Sintering in the Making of A Micro Heat Exchanger, Michigan State University, 2004.

• Master of Science, Engineering Mechanics of Mechanical Engineering, 2001

Thesis: An Embedded-Tow Model for Crush Simulation of Textile Composite Tube, Michigan State University, 2001.

• Associate Professor and Senior Lecturer of Multimedia University Melaka, Malaysia 
• Senior Staff Mechanical Engineer, Motorola Technology Sdn. Bhd. , Penang, Malaysia 
• Silver Medal, in international event Research Innovation Commercialization & Entrepreneurship Showcase 2021 (RICES-2021)
• Gold Award, in International Perlis Engineering Research & Learning Innovation Symposium (i-PERLIS 2021) 
• Gold Innovation Award, in The Industry Networking & Business Pitching 2018 (EREKA) held at University Malaysia Perlis, for Sustainable Polymer Nano-composite
• Silver Award, in Infineon Research Poster Competition by Infineon Technologies Sdn. Bhd., for Ball-grid-array Solder Failure Modeling. 

• Kok, C. K., Koh, E.R., Chen, G.M., “Modelling Mode I Failure at Crack Tip with Verifications using Digital Image Correlation”, Digital Futures International Conference: Multimedia University Engineering Conference, Virtual Conference June 21-23, 2021.
• Kok, C. K. and Kwon, P., “Finite Element Simulation of Compaction of Ceramic Powder In Making Meso-scale Heat Exchangers,” Transactions of NAMRI/SME, Volume XXXII, 2004, pp. 423-430.
• Kok, C.K., Loon, K.T., Ervina Efzan, M.N., Ooi, C.C., “Micromechanics Models of Industrial Printed Circuit Boards for Bending Analysis”, Advanced Science Letters, Vol. 24, No. 11, 2018, pp. 8826-8830.
• Kok, C.K., Ooi, C. C., Ng, J. J. and Liew, K. W., “Experimental Study and Modelling of an Adhesive-Bonded Polycarbonate Assembly for Application in Consumer Electronics,” Journal of Adhesion, No. 89, 2013, pp. 247-263.